● LGA4189 1U EVAC Passive cpu cooler
● Delicated for 1U Server and blade servers
● Aluminum Fin Stack,4 Heatpipes and Cooper Base
● Upto 280W CPU Power Heat Dissipation (Note:Matching with the application environment &Cooling fans)
● Recommend for Intel® 3rd Gen. Xeon Scalable Processor
|
CPU Support |
Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake) |
|
CPU Socket |
FCLGA 4189-4/5(Socket P4/P5) |
|
Screw Type |
#8-32 |
|
Installation Torque |
8 in-lb |
|
Solution |
1U Server and blade |
|
Dimensions |
169 x 154.5 x 25 mm |
|
Weight |
430 g |
|
Material |
Copper Basement，4Heating Pipes， Aluminum Fin Stack |
|
Fin Thickness |
0.3mm |
|
Fin Pitch |
1.5mm |
|
Thermal Grease |
SHIN-ETSU X23-8079-2 |
|
TDP |
280W |
*All product specifications and product images are subject to change without notice
|
CPU Support |
Intel® 3rd Gen. Xeon Scalable Processor (code name Ice Lake and Copper Lake) |
|
CPU Socket |
FCLGA 4189-4/5(Socket P4/P5) |
|
Screw Type |
#8-32 |
|
Installation Torque |
8 in-lb |
|
Solution |
1U Server and blade |
|
Dimensions |
169 x 154.5 x 25 mm |
|
Weight |
430 g |
|
Material |
Copper Basement，4Heating Pipes， Aluminum Fin Stack |
|
Fin Thickness |
0.3mm |
|
Fin Pitch |
1.5mm |
|
Thermal Grease |
SHIN-ETSU X23-8079-2 |
|
TDP |
280W |
*All product specifications and product images are subject to change without notice
 |
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